Product

Products

LVP400H07P4-3IT

  • Compact Package

  • High Power density

  • Low Switching Loss 

  • Assembled in PCB 

  • Integrated NTC temperature sensor

  • Isolated Baseplate by Al2O3 substrate 


Application

  • Energy Storage Systems

  • Solar Applications

  • Three-Level Applications

Internal Circuit Diagram

Specification Parameters

TYPET1, T4T2, T3CircuitPackageTechnology
VCES
Volts
IC
Amps
VCE(SAT)
Volts
Ptot
Watts
VCES
Volts
IC
Amps
VCE(SAT)
Volts
Ptot
Watts
LVP400H07P4-3IT650V400A1.50V1200W650V400A1.50V1200WI typeEZPACK 3BTrenchFS


Industry Applications

BYSM Continues to Deepen its Efforts in the Field of High-end Precision Components
Building a National Brand and Linking the World with Intelligent Technology

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