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LHG820S08B7P1

  • Compact Design

  • Low VCE(sat) 

  • Low Inductive design

  • Integrated NTC temperature sensor

  • Flat & PinFin Baseplate available 


Purchase Consultation

Application

  • Automotive Applications

  • Hybrid Electrical Vehicles

  • Motor Drives

  • Commercial Agriculture Vehicles


Internal Circuit Diagram

Specification Parameters

TYPEVCES
Volts		VGES
Volts		IC
Amps		VCE(SAT)
Volts		(EON+EOFF)
mJ		TJPtot
Watts		CircuitBaseplate
type		PackageTechnology
LHG820S08B7P1750V ± 20820A1.30V37.0mJ175℃714W6 PackPinFinHP7Trench FS
LHG950S08B7P1750V ± 20950A1.30V42.5mJ175℃870W6 PackPinFin
LHG400S12B7P11250V ± 20400A1.65V37.5mJ175℃870W6 PackPinFin
LHG400S07B6F1650± 30400A1.90V14.2mJ175℃1250W6 PackFlatHP6
LHG400S07B6P1650± 30400A1.90V14.2mJ175℃811W6 PackPinFin


Industry Applications

  • Industrial Control
  • New Energy Vehicles
  • Rail Transit
  • Smart Grid
  • Photovoltaics

    • BYSM Continues to Deepen its Efforts in the Field of High-end Precision Components
    Building a National Brand and Linking the World with Intelligent Technology

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